MUHAMMAD FAISAL IMTIAZ

Working on my Master’s Project Thesis focused on Cryogenic Atomic Layer Etching (ALE) of Silicon-based materials (Si, SiO₂, Si₃N₄, TiO₂) using different plasma gases, with emphasis on CHF₃ chemistry. Investigating surface modification and removal mechanisms under cryogenic conditions for atomic-scale precision. Optimizing etch selectivity, anisotropy, and by-product volatility for nanofabrication. Exploring applications in semiconductor devices, MEMS/NEMS, photonics, and quantum chips.

Erasmus exchange semester focused on Plasma Engineering at Polytech Orléans. Gained hands-on experience and research exposure across diverse plasma applications, including: DC Discharges – gas breakdown and lighting applications RF Discharges – high-frequency plasma systems LIF (Laser Induced Fluorescence) – advanced plasma diagnostics Plasma Jets – atmospheric pressure applications Reactive Ion Etching & Inductively Coupled Plasma Dielectric Layer Deposition (PECVD)

Participated in a Blended Intensive Program at Babeș-Bolyai University focused on cybersecurity strategies in the era of AI. Attended expert-led sessions on AI-driven cyber threats, ISO 27001, EU NIS2 directive, and cybercrime law. Took part in hands-on activities including a bootcamp challenge, legal tech workshops, and international networking events with peers and professionals across Europe.