Nagarajan Palavesam Ph.D.

• Management and control of the entire product life cycle from definition, feasibility to qualification and handover to production • As the technical interface to Subcons, handles all interactions between Subcons and internal Business Unit

- Acquistion and Management of industrial as well as public funded projects - Thermo-mechanical Finite Element Method simulations (ANSYS) - Development of novel approaches and solutions for integration of flexible electronic components for diverse applications - Reliability analysis of flexible electronic components and systems - 3D Computer Aided Design (Inventor) - Design of Experiments - Characterisation of electronic devices and systems

Tutor for the course "Flexible Hybrid Electronics and Integration" for Postgraduate students at the Faculty of Electrical and Computer Engineering

- Project Management - Reliability analysis of electronic components integrated in foils for flexible electronics - Design of Experiments - Mechanical and Electrical Reliability Analysis of Flexible Electronic components - Finite Element Method simulations for reliability Analysis of thin chip integrated in flexible polymer foils - Dissemination of results at Project Meetings, Summer Schools and International Conferences

Analysed mechanical reliability of flexible electronic components for electronic skin

Characterised electrical parameters of Graphene transistors on flexible substrates for electronic skin

Conceptualized integration technologies for sensors for electronic skin

Developed processes for micro fabrication of non-magnetic tips to be used in a novel Scanning Tunneling Microscope to study atomic-scale spin contrast

Studied a Tunable Diode Laser Absorption Spectroscopy based sensor to measure the concentration of Ammonia in a gaseous mixture

Analysed the effect of Conductive Discharge Layer (Polyaniline based) on the resolution and roughness of the photoresist to reduce Image Placement errors in Electron-beam lithography

- Fabricated Nano-electronic devices using Zinc Oxide nanowires by selective patterning with Electron-beam lithography - Characterised Resistivity of fabricated devices using 3 point probe measurement