Ing. Raja Fazan Gul

• EU Supply Chain Lead for Thin film interconnect (TFI) • EU Supply Chain Lead for MTP Production sites • Technical lead for an EU funded project (INSPIRE) • Acting as MTP Subject Matter Expert (SME) for customer visits and technology demonstrations. • Lead and guide cross-functional Root Cause and Corrective Action (RCCA) investigations. Provide engineering input and technical expertise for failure mode effect analysis (FMEA) for projects transferred to customers/partner sites.

- Process Development: Validation and existing process optimization - Development and Establishment of new MEMS fabrication processes - Process Flow and Travelers generation - Processing/Fabrication of Piezoelectric and III-V Semiconductor devices - Integration of Micro devices using MTP - Layout design (L-edit, KLayout) - Inter-team collaboration to meet deadlines

- Process Development: Validation and Optimization. - Process Flow and Travelers - Processing and fabrication of Piezoelectric devices. - Making devices Micro-Transfer print (uTP) ready. - Integration of Micro devices on Non-Native substrates by Micro Transfer Printing. - Reporting and Presenting Results to Customers. - Layout design (L-edit, KLayout).

- Processing of Silicon, AlN and Lead free Piezoelectric ceramics - Fabrication of transferable devices (uTP). - Integration of Micro devices on Non-Native substrates by Micro Transfer Printing. - Process improvement. - Improving yield of transfer printing devices.

Worked in Clean room environment and performed - Photo-Lithography - Optical Microscope Analysis - Atomic Force Microscopy for Thin film characterizations - Wet Etch

Energy Science, Surface Chemistry, Materials Science

-Semiconductor Physics -Materials Science -Quantum Physics -Electromagnetism -Mechanics -Optics