Rajeevan Rajagopal

3D-modelling, Simulation (FEM) von Sensormodellen Identifizierung und Analyse von Dehnungs- und Stress-sensitiven Parametern in den verschiedenen Sensorstrukturen Sensor Prototypenentwicklung im Labor Charakterisierung und Test von Sensormodellen in dehnbaren Testmaschinen Design und Entwicklung von Elektronik für dier Signalaufbereitung Analyse der Sensitivität verschiedener Modelle durch Vergleich der Ergebnisse von Simulation und Experiment

• Developed an embedded hardware prototype for real-time data acquisition and monitoring of pressure and temperature sensors with resolution (1mbar, 0.1°C) • Implemented V-model life cycle • Analog and digital circuits design, PCB layout designing, component integration, soldering and testing • Programmed ATmega128P Microcontroller using Embedded C for real-time DAQ, controlling of pneumatic actuation and LCD interfacing

Automotive Sensor Systems, Semiconductor Physics, Micro optical systems, Micro Systems Design, Surfaces Thin films and Interfaces, Technologies for Micro and Nano Systems, Integrated Circuit Design Transistor Level,Reliability of Micro and Nano systems, Micro and Nano Devices.

Analog and Digital Electronic Circuits, Solid State Devices, VLSI Circuit Design, Control Systems, Electromagnetic Theory, Signals and Systems , Analog and Digital Communication are some of the core modules. Experience with Analog and Digital Circuit Design, Source and measurement systems, Soldering