Simon Schneiter

High-end FPGA/SoC modules and base boards with transceivers up to and beyond 25 Gb/s. EDA library management design, schematic and PCB design, qualification and validation procedures, signal routing characterization using TDR.

New time-of-flight 3D camera platform: System design for low cost, mechanical and thermal concepts, embedded software design, sensor control logic, design for production and testing. Testing electronics for mass-production wafer-probing. Sensor characterization and optimization plattform.

Electronic and system design and implementation for 3D cameras with time-of-flight technology for industrial applications.

Leader of electronics engineering team. Development of smart-camera systems and hardware. Development of computer vision solutions for industries (automotive, mining, petrol industry, steel, process automatisation)

Creation of the electronics lab as part of a new R&D institute in Brazil. Project development

Design and implementation of opto-electronics systems. Development and characterization of image sensors. FPGA centered custom testing and evaluation platform for image sensors. Analog circuitry for sensor signal and high speed modulated LED illumination. Design and implementation of the world's smallest time-of-flight (TOF) 3D Camera in the EU project ARTTS (http://www.artts.eu)

Guitar with a Digital Interface: A DSP and ethernet based system integrating modern network technology and signal processing technologies into a musical instrument. System design and implementation (DSP, power-over-ethernet, preamp design, 14 audio channels, embedded and host software).

Microelectronic, Communication technology, Signal processing, Computer vision, Neural networks,