Ayoub Seddik
Angestellt, Pr. FPGA Engineer, Rockwell Collins Deutschland GmbH, a part of Collins Aerospace
Heidelberg, Deutschland
Werdegang
Berufserfahrung von Ayoub Seddik
Bis heute 8 Jahre und 7 Monate, seit Okt. 2015
Pr. FPGA Engineer
Rockwell Collins Deutschland GmbH, a part of Collins Aerospace
FPGA design, integration and verification (front-end/back-end) for airborne electronic hardware.
4 Jahre und 4 Monate, Juli 2011 - Okt. 2015
Hardware Engineer
HCELL-engineering
Design and verification of embedded systems for airborne electronic hardware according to the assurance guidance RTCA DO254.
6 Monate, Feb. 2011 - Juli 2011
Final Year Project
Altronic
-Design and development in VHDL of an OFDM IP for LTE channel. -Environment: Altium Designer, Nanoboard3000, FPGA Xilinx, VHDL.
With the MMC team (Module Manufacturing Center), the project consists of the design of a test board for the manufactured modules.
3 Monate, Juni 2009 - Aug. 2009
First internship
CIV-Tunisia
Within the test department, the objective was to participate to the manufactured PCB test activities
Ausbildung von Ayoub Seddik
2 Jahre und 10 Monate, Sep. 2008 - Juni 2011
Electronics
ENISo
Electronics systems desing
Sprachen
Englisch
Fließend
Französisch
Fließend
Deutsch
Fließend
Arabisch
Fließend