Ed Samuel Destajo

o Part of the design team and performs engineering related studies under Global Hardware Process including Worst Case/Thermal Analysis, Testing, DFMEA, RPA, RFQ and FTA on various OEMs. o Performs FSV (First Sample Validation) of parts coming from the manufacturing plant for customer delivery. o Prepares charts, graphs and diagrams to illustrate various engineering analysis and results with respect to Global Hardware Process

o Manufacturing Engineer in-charge for Backend/Taping Process of multilayered chip inductors. o Responsible in preparing and checking operating procedures that involves machine standards, program setting, operation procedure for newly introduced equipment and machines. o Responsible for machine evaluation to ensure that it is running at functional standards.