Florian Bieck

Jan 2023-Mar 2023: Software company in Hannover, Germany - business planning and operations management for software development projects Feb 2023 - October 2023 Automotive Company in Essen, Germany - Customer Escalation Manager: Managing critical customer escalations wrt to deliveries, coordinating internal stakeholders like planning, production and logistics, handling customer meetings and managing expectations, drafting and executing recovery plan.

Currently, I deliver services as GM Operations for 24x7 operations. I have complete responsibility of output, yield, cost, delivery / EHS, and site P / L. I supervise h/c of 150. My key career highlights are: • Generating incremental revenue by increasing factory loading form ~12k to 20kwafer/m • Enabling 15% cost reduction by using lean methodology • Obtaining 16949 Automotive (IATF) Qualification • Streamlining on-time delivery with to 90% rate. • Accomplishing 99.8% yield improvement

Previous to GM, I delivered as Production Director at International Rectifier, where I directed staff of 75 to execute daily operations of 24x7 wafer fab in Singapore, while reporting to VP Operations. I was also in charge of multiple departments including manufacturing, planning & materials, industrial engineering, business systems, and IT. I spearheaded the Project of Technology Transfer from UK to Singapore that resulted in Singapore factory having benchmark performance at International Rectifier

I stewarded the project for start-up of new Singapore fab to transfer Back-End technologies from R&D phase into a stable production and deliver to Singapore. The project technological portfolio included wafer thinning, metallization, dicing, inspection, photo & etch

Here, I led the project and successfully transferred technologies like Cu-Pillar, Cu RDL, lead free bumping, and polyimide process from US lead fab to production in Singapore, including conversion from 8” to 12”.

As an Engineering Manager at Singapore, I led the process & equipment engineering team and managed Wafer level packaging for optical sensors. At Berlin, while delivering services as Process Integration Manager, I oversaw Process integration for a new wafer level packaging for optical devices. Planned and led the transfer of technology from Berlin to Singapore.

I delivered as in-house consultant for manufacturing technology in Germany, advising on precision and optical manufacturing