ILLIA SHYLOV

 Designed from scratch military telecom device operating up to 80GHz frequency and supporting all cellular bands worldwide including 5G network (RF + digital).  Created and maintained semiconductor component library and integrated with Agile PLM system  Supervised 3rd party layout services

 Developed CatM/LTE/IoT/NB-IoT modules and wireless terminals, including high-end pcb and evaluation boards with annual production >10M pcs.  Improved multilayer PCB stack-up with HDI technology to solve reflow delamination issue in cooperation with PCB & PCBA suppliers  Designed comprehensive multilayer board design for high-speed ultrathin PCB (<0.5mm)  Created multisource semiconductor library and implemented SAP PLM system

 Designed LCoS Imager PCB prototype with wirebonding technology (ECAD to MCAD integration) using own ASIC (40nm).  Developed and designed evaluation boards and microdisplay backplanes.  Designed and optimized layout design using HDI vias and other technologies that increased density of the components by 4 times and reduced costs by 30%.  Projects are developed in: Mentor Xpedition / DxDesigner; OrCAD / PADS; OrCAD / Allegro.

 Designed from scratch high-end 4K STB and model variety for consumer market and operators in different countries with custom requirements.  Interfaces: PCI-E, USB, SATA, CF, MMC, SD, Ethernet, HDMI, Z-Wave, AES/EBU/ S/PDIF.  Buses: I2C, I2S, UART, CSI, SPI, CAN.

 Developed universal stack-up for rigid-flex PCB that reduced production costs by 30% and increased production yield up to 99.8%  Designed and optimized layout design using HDI vias and other technologies that increased density of the components by 4 times and reduced costs by 30%  Improved manufacturability for mass production automotive PCB in order to reduce production time by 40% (DFM for EU automotive industry customers)  Supervised small team of 5 pcb engineers

 Developed proprietary capacitive technology PCB prototype based on the latest Xilinx Zynq FPGA with 32Gbit transceiver banks  Designed flex pcb antenna based on PTFE laminate that reduced board size by 35%, while retaining all the necessary parameters  Researched and developed PCB integrated planar transformer that reduced PCB height by 2 times and improved performance

 Designed 56-layer PCB with close attention to EMI / EMC parameters for one of the world leader telecommunication company  Interfaces: SDRAM, DDR 1/2/3, SATA, PCI, PCI-E, DVI, HDMI, USB, ETH, SERDES.  ECAD systems: Mentor Expedition, Board Station, OrCAD Allegro.