Kenji Iijima

*Computer Module Formfactors: COM-HPC, COMExpress, SMARC, QSeven *CPUs: Intel (Xeon, Core, Atom), AMD (Ryzen, EPYC), NXP (i.MX family), Texas Instruments (Jacinto) *Segments: Robotics, Audio stream system, HMI with camera, Test machines, etc Tasks *Product promotion to the customers from technical perspectives *RFQ (request for quotation): Technical proposals on customers carrier board based on their requirements *Technical trouble shooting claimed from customers: *NRE/customization management

Key segments: Industrial Ethernet/Network, Embedded Computing platform with camera and HMI, Embedded AI Product lines, fields of expertise: *Microprocessor (Cortex-A based) *Computer module: SMARC, QSeven, SODIMM, etc *Industrial Ethernet: Time-Sensitive-Network (TSN), EtherCAT, PROFINET, Single Pair Ethernet *High Speed Serial: MIPI D-PHY, PCI Express, USB Request for Quotation (RFQ) to customer engagement

Technical coordinator with Tier 2 supplier management (ARM based application SOC vendor) Hardware technical project lead to deliver Infotainment POC to present to OEMs and Tech Show

Technical Pre-sales in Internet-of-Things (IoT) Technical sales for telecom: Wireless infra (3G/HSDPA/LTE), FTTH and Next 2nd level technical customer support Early Access (beta) Program Management for embedded market in Japan: Development of local distributor’s technical capability

Thesis: Power & data rate optimization algorithm for base station system Key Subjects; Mobile Radio Communication, Signal Processing, Optical communication, etc

Thesis: Multiple antennas for mobile phone Key Subjects; Linear Circuit, RF, Microelectronics, Digital Circuit, Communications, C++ programming, etc

Math, Physics, Chemistry