Nikhil Kulkarni

Working on projects which involve Timing closure, floorplan, Powerplan, CTS, Routing and Physical verification

 Calculation of Joule heating inside nano-sized geometries in COMSOL  Multi-layered structure with varying electrical and thermal parameters  Testing of different materials (YMO and BFO) for upcoming memory devices called as memristors

Topic: Simulation of Joule heating for Ceramic material in COMSOL Multiphysics Creating 3D geometries, Analysing different material by changing the properties like electrical conductivity and thermal conductivity, Analysing and calculating joule heating in complex 3D geometries

 Implementing the ideal solid model with the transfer of reference points from real solid model  Various approaches for image reconstruction tried and tested  Manually modify the ideal model to adjust according to the real model  Proven method to transfer surface body in ANSYS

Topic: 3D model reconstruction of DSLR images Capturing images of an object using DSLR, Converting multiple images into solid model, Applying boundary condition to the solid model, Analyis of the solid body.

System design, Microsystem design, Reliability, Semiconductor physics Project: Circuit-simulation, Design and analysis of Current mode logic; Design procedure for bandgap reference topology (Mentor Graphics Design Architect IC)

VHDL, VLSI Design, Digital logic design, FPGA, Circuit design and Simulation, EDA, Network theory Project: VHDL code for Logic gates, Elevator, Finite state machine, Mealy and Moore circuit.