Piash Das

System and Analog Design at the Chair of Highly-Parallel VLSI Systems and Neuromorphic Circuits (HPSN)

Development of a measurement setup to characterize TDDB of ferroelectric thin films Measurement of CV and feedback into optimization Design of ferroelectric varactor single mount devices Design of VCOs by usage of ferroelectric varactors

Masters Thesis student in Mixed-Signal Design of high-speed packaging and chip-to-chip communication (Transceiver) at the Chair of Highly-Parallel VLSI Systems and Neuro-Microelectronics

I am working as working assistant for the project 200/300 mm wafer process line for wafer-level 3D system integration.

The main function is to monitor & analyze KPIs of 3G (WCDMA, HSDPA, HSUPA, HSPA+), 2G & 2.5G GSM network. It is our main responsibilities to maintain the network in optimize level based on KPIs. CS (Circuit Switched) and PS ( Packet Switched) KPIs are also been monitored and after that we recommend parameter changes on worst performing cells. Counter level analysis is also required to process the KPIs.

The main function is to monitor & analyze KPIs of 2G & 2.5G GSM network. It is our main responsibilities to maintain the network in optimize level based on KPIs. CS (Circuit Switched) and PS ( Packet Switched) KPIs are also been monitored and after that we recommend parameter changes on worst performing cells.

Brand development, web site traffic growth, web site UI and advertising revenue. Developed brand strategy and statistics systems. Team Leader of Technology web portal http://thetechjournal.com/

Semiconductor Technology, Materials for Nanoelectronics, Vaccum Technology, Semicnductor Devices and Process Control & Integration, Semiconductor Processes: Lithography, Etch, Diffusion, CVD/PVD, CMP