Raghavendra Nunna

 Direct and coordinate fabrication of power electronic circuit substrates with high heat dissipation, and high mechanical strength  Evaluate new materials and development technologies and secure the IDs by publishing patents  Present designs and reports to customers and design committees for approval and discuss needs for modification.  Collaborate with external institutes and universities to develop cutting-edge research for future products

 Responsible for developing new polymer-bonded cutting tools from phase tendering till industrialization by collaborating with team members from 4 different nations Germany US, India & China  Led a team of 4 engineers and 3 technicians to implement the tests in the laboratory for R&D projects  Work with manufacturing, application team, product management team, and marketing to establish tools in grinding/cutting/lapping and achieve the new product sale committed in the business plan.

 Developed and validated a novel vitrified bond using nano additives and contribute to 30% performance/cost improvement  Develop and deliver (SOP) Standard Operating Procedures on laboratory equipment and supporting documentation that supports daily lab activities assigned to staff  Proactive interaction with local and global PM/AE teams to identify new business areas organized efficient conference meetings authored high quality technical documents

 Designed thermoelectric materials using the chemical intuition provided by molecular orbital diagrams, tight binding theory, and a classic understanding of bond strength Analyzed the composition – structure – property relationship from the atomic to the macroscopic level using XRD, SEM, EBSD, TEM  Raised 4M CNY lab funding from Chinese Academy of Sciences by proving valuable results and new scientific method to improve the performance of thermoelectric materials