Roberto Dossi
Fähigkeiten und Kenntnisse
Werdegang
Berufserfahrung von Roberto Dossi
- Bis heute 6 Jahre und 2 Monate, seit Apr. 2019
Director
Semi Europe
Technology Advisor for the whole team. Responsible for Programs and for all Technology Communities. Report to President Europe Region. o In charge for Technology support and Technology communities development: focus on Industry 4.0 and coordinate with all technical ecosystem (Smart Manufacturing ,Smart Transportation, Material, Test). o Strong networking covering complete ecosystem from material to OEM producers.
- 2 Jahre und 6 Monate, Okt. 2016 - März 2019
Product Development Manager
OSRAM GmbH
Develop innovative VCSEL and IoT sensors new systems. Lead senior managers Team. Report to VP engineering. o Production ramp up in Malaysia o Disruptive Technologies Development for new VCSEL and Sensor projects covering Competitors benchmark and long term roadmaps definition. o Responsible for just in time Technology and Products Transfer to Far East production.
- 3 Jahre und 3 Monate, Juli 2013 - Sep. 2016
Package and Wafer Foundry Business
ZMDI AG
Overall responsible for Package Roadmap and Wafer foundries interface. Focus on new System development and 3D Technology enabling and implementationin volume production
- 1 Jahr und 7 Monate, 2012 - Juli 2013
General Manager Engineering
VP Machine Shanghai Rep Office
VP is a fast growing Company leader in the design, development and manufacturing of "turn key" lines and special equipments for the hose and cable Industry. The VP dynamic growth is due to the high technical background and built-in know how, with particular regard to the quality and manufacturing installed capacity. Responsible to support existing customers mainly in Guangdong and Hebei Regions
- 2009 - 2012
Director
SMIC Shanghai
M&S CTM Engineer Europe Region Head
- 2007 - 2009
Program Manager
Qimonda Flash GMBH
System portfolio enabling for NAND Flash memory (Special focus on Solid State Disk) Low cost subcontractor interface and enabling
- 2006 - 2007
Manager Concept Engineering
Qimonda Flash GmbH
Senior Staff Expert Responsible for Flash Package roadmap / strategy / specification Official interface for Through Silicon Vias technology New Assembly Technology Development owner for QFL (Bumping, RDL, high stacking Packages, etc)
- 2004 - 2006
Manager Operation
Infineon Technologies GmbH Dresden
Overall responsible for Flash Memory Package definition / development Provide complete Back End Flash Memory scenario / Find best BE partnerships BE subcontractor enabling / BE cost evaluation and optimization Drive products to production
- 2001 - 2004
Manager Assembly Technology
STMicroelectronics
Wireless package portfolio owner ( CSP, µBGA, MCP and TSOP) Special tasks on advanced 3D packages and SiP
- 1999 - 2001
Project Manager
ST Microelectronics
Responsible for Multi Memory Products ( Flash + PSRAM Memories)
- 1993 - 1999
Senior Product Engineer
ST Microelectronics
Responsible for test programs Official Business Unit interface for Hardware . Follow new Flash products production start
- 1989 - 1993
Process Engineer and Team leader
STMicroelectronics
Responsible for Metrology and Calibration; Team leader Conductive thin film deposition group
Ausbildung von Roberto Dossi
- 1 Jahr und 1 Monat, Nov. 2010 - Nov. 2011
MBA
Shanghai Jiao Tong University
Chinese Business development
- 1981 - 1987
Science Physics
Milan Statale University
Solar Panels, Semiconductor, High energy radiation damage
Sprachen
Englisch
Fließend
Italienisch
Muttersprache
Deutsch
Gut
Chinesisch
Grundlagen
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