Soongun Kwon

Key Projects & Achievements in 2024: 1) 400A 1200V Thyristor Module Process Development 2) Development of New Diode and Thyristor Modules (600A, 1200V) 3) Volumetric Dispensing Introduction Key Projects & Achievements in 2023: 1) Interconnection Process Improvements 2) 900A 1600V Product Solder Form-Factor Change 3) R&D Line Relocation

Power Module for E-GMP electric vehicle (Hyundai IONIQ EV) Power Module Engineering Team for NE E-GMP platform Senior Engineer Double-side cooling power module for HEV & EV process development and launching to mass production

C-PKG Process Team : Wire bonding process engineer (2014, 02 ~ 08) Project: Au Wire thinning for cost reduction (25um -> 20um) Objective: Apply Au wire 20um to quad stack die package product Responsibilities: ModuleTeam, SSD process engineer (2014, 08 ~ 2015.07) - Review productivity of new products and Qualification of New Solid State Drive - Establishment and distribution of product mass production guide

Power semiconductor product development 2012 Product development for diode module, 600V 200A, * Product design and material review * Warpage improvement and failure analysis. * Transfer 8 devices to production line. 2012 Product development for IGBT 6-Pack Module, 600V 50A, 75A, 100A * Project management and material cost improvement. * Die soldering process. -Title of the invention: "Assembly tool for power semiconductor module", application number in South Korea: 10-2014-0051410 (April 29, 2014)

Semiconductor package development Responsibilities - Responsible for new package design review, and BOM selection. - New package qualification and build report. - Product launching to the production line. - Customer incident handling and reporting 8D report. - Failure analysis for customer quality incident - Semiconductor package design and parameter optimization. - Material DOE design and experiment analysis (S/W: Mini-tap, middle level ) - Project planning and organization.