Tauseef Siddiqui

Low power Buck DC-DC Converters IC design team. Design digital logic for start-up control and interface,IIC,(RTL to layout) for DC-DC converters, using Cadence Athena flow. Design of memory control, test modes for NVM memory of DC-DC converter Create SDC files for meeting timing requirements. Creating linearized models for different blocks for a DC-DC converter. Perform pre-silicon full schematic design verification using both schematic and Verilog AMS flow based verification of DC-DC converters.

Analysis of an optimal design of an integrated isolated communication channel for industrial sensor application. -Modelling a complete digital communication system to analyse the Capacitive Isolation channel -Analysis of the energy efficiency and robustness of a bit transfer w.r.t: - Power/energy dependence of data transfer - Data Compression algorithms & Performance - Safety and Reliability Aspects (Error Detection &Correction Code) -Design and Verification of digital blocks for a prototype chip

Hardware Development for Acoustic Based Condition Monitoring System. Building Virtual Instrumentation System using National Instrument LabWindows/CVI and NI PCI6251 DAQ board. Building complete Hardware for Acoustic Condition Montoring System using SMM3110 MEMS microphone as sensor.

IC Packaging Thermal Concept Designing Tasks involved support the construction of thermal database by actively collecting package/process information from concept team and backend team in both Europe and Asia  handling requirements to simulation team  take care of tracking simulation progress and compile simulation results

I work as an Intern at Freescale, Automotive Radar IC Design Team, for their Advance Driver Assistance system (ADAS). My scope of work includes: -> to investigate mixer concepts and topologies targeting highly linear and low noise -> to choose the best architecture for meeting the requirements -> to design the mixer using simulation and optimization in ADS, Momentum -> to perform layout, parasitic extraction and re-simulation of the circuit -> to assess its robustness through corners cases simulation

Working Student Technical Product and System Assessment at Intel Am Campeon, Munich Preparation of package and PCB analysis of Mobile Communication products like smartphones, tablets focus on basebands, RF, analog/power management ICs. Extraction of package and PCB key parameters derived from lab results. Preparation of Competitors SoC technological trend reports. Transfer of Dye Cross-Sectioning for Intel's reverse engineering lab results and reports into Oracle based MCG Database for Intel-wide usage

Conducted market research and performed business analysis for global technological and communication firms. Interacted with clients to understand their strategic problems in entering newer markets by designing and testing of online surveys for conducting market Research. Comprehending trends in technology markets, industry reports, benchmarking and interviewing experts, using databases like OneSource, Nexis, and Thomson Research.

Involved in the Project management of the technical detailing, specification installation and functioning of Siemens Imaging Machines. Participation in the team responsible for exploring competitor’s technology, products and market for Siemens Product Development Team. Basic Training on Siemens computed tomography, magnetic resonance and molecular imaging Systems.

Digital Electronics, Analog and RF electronics, Embedded Systems and Computer Architecture, Signal and Systems, Electrical Circuit theory, Digital Signal Processing, EMFT, Control Systems, Instrumentation and Control Systems, Engineering Mathematics, C++ Programing, Semiconductor Engineering.