Dr. Ahmed Zayed

Scope cover world-wide strategic customers, focusing on leading edge technology within BL DUV. My emphasis will be on New Product Development (NPI), supporting intercontinental business growth and associated strategy definition. All aimed to secure ASML & customers global competitive positions. In my role, I have to sustain a delegate balance between technical capabilities, time to market and corporate WW targets. Ultimately, securing ASML interests as "preferred business partner" & retain market dominance.

Job Mission - Leading cross functional teams in global operations (Program, D&E, Sales, CS, Logistics & Quality). - Asses competitive landscape & define levers to increase & secure global market share. - Drives plans for new products development\introduction & interfaces with internal development organization. - Secure volume business deals (VPA) - Define products and service roadmap based on market demands.

- Manage ASML customers projects in state of the art semiconductor fabs (worldwide ). - Identify strategies to stretch lithography & associated processes beyond its specification. - Cooperate and drive the applicable ASML organization to meet cooperate targets. - Be part of ASML success in expanding lithography beyond moore's law. - Promote ASML products and demonstrate long term benefits.

- Manage design and upgrade of new system's within ASML applications. - Consolidate technical company identity in communication with customer & other stakeholders. - Review technical contributions from the team and structure team contributions. - Define requirements of new functional modules incorporation with system disciplines. - International support (escalation's only): South Korea, Taiwan, USA, Japan and Germany - Reporting to senior management and customer heads of staff.

- Official representative of ASML working team in Taiwan with ASML HQ in Netherlands. - Onsite customer support operation responsibilities; mainly in Korea, Taiwan, US, Singapore and Germany (on a regular basis). - Specify, design, develop, realize, and test subsystems within the limits of system specifications, costs and project planning. - PM activates: define road map for tests and team future activates in HQ and customer sites. - etc.............

• Project planning & execution • Time and Management Scheduling • Cost Estimation\Reduction • Resource planning • Cost Planning • Risk management • Project Planning via MS Project: Project Initiation and structure, identify and assess risks, create work breakdown structure, task scheduling, resource and cost planning • Block Based qualification status measure • Gantt chart and network structure

Sputtern Optimierung von metallischen Dünnschichten, Mikrostrukturierung von Dünnschicht Strukturen unter Verwendung von UV Lithografie, chemische und trockene Ätztechnologie, Unterstützung der Werkstoffentwicklung, Synchronisation der Abläufe zwischen der Materialentwicklung,Versuch und Produktion

Projektingenieur: Herstellung und Charakterisierung von NiTi Dünnschicht, Herstellung von Dünnschichten mittels PVD, Lithografie, Dünnschicht ätzen, Fehler Analyse und andere Reinraum Pro-zessen. Arbeiten im internationalen Team, Lehrtätigkeit als Betreuer von Laborpraktika

Was involved in several experiments on metallic and composite materials.

Clean room technologies, PVD magnetron sputtering,UV Lithography& metrology tools,physcis, process characterization/optimization of lithography equipment/process, XRD,SEM,TEM,XPS,AFM,etc, Yield engineering on wafer, Etching, Epitaxy science, MEMS course teaching , Know-hows experience in R&D

MEMS tech,Vacuum tech, Electronic materials & semiconductors, Silicon tech, Thin film tech, Failure analysis & material characterizations, Thermodynamics, physics-mechanics of materials, Optical macro inspection, metrology systems, Epitaxy growth, analysis, diffusion analysis, crystallinity,etc

Materialwissenschaft und Maschinenbau