Ali Nadwah
Bis 2024, New Introduction Product Engineer NPI - Automotive product, ams OSRAM Deutschland
Regensburg, Deutschland
Über mich
An engineer, Interested in Microsystems and semiconductor packaging. Seeking knowledge about optical components, MEMS design and material.
Werdegang
Berufserfahrung von Ali Nadwah
7 Monate, Sep. 2023 - März 2024
New Introduction Product Engineer NPI - Automotive product
ams OSRAM DeutschlandTechnology: Pixilated matrix LED for the Automotive industry, 8-inch LED on IC wafer. *material-to-customer delivery management, and yield analysis, 8D and FMEA quality and risk assesment. *Product handover from development to production and process optimization. *Wafer processes deviation monitoring in the production line/ clean room. *Process owner for the visual inspection level of the final product.
6 Monate, Feb. 2023 - Juli 2023
RGB Laser package development - Produktentwicklung
ams OSRAM DeutschlandMaster thesis: Correlations and influence parameters of lens quality and active alignment precision for beam quality in RGB laser module with collimation & combination optics Optical image analysis, laser beam quality improvement, optical elements surface, and metrology measurements and analysis.
11 Monate, März 2022 - Jan. 2023
Laser Product devekopment - Semiconductor product
ams OSRAM Deutschland- R&D in the Packaging design of Laser Products - Laser testing and Characterization - Electro-optical Data Analysis - Active optical alignment for beam-shaping
8 Monate, Mai 2022 - Dez. 2022
Lab intern - Sensor Systems Laboratory
Ostbayerische Technische Hochschule RegensburgInvestigation of methods for determining the relative permeability of magnetic materials - COMSOL Multiphysics simulation.
4 Monate, Okt. 2021 - Jan. 2022
Semiconductor packaging and assembly - UV LED and Laser devices
Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik
UV-LEDs Assembly and Packaging. Chip Optical inspection UV LEDs and Laser diodes assembly and packaging using cleanroom tools: Direct bonding, Wire bonding. Interconnect material soldering Schear test - Pull test ESD Diodes characterization General study on Failure modes Analysis
Ausbildung von Ali Nadwah
Bis heute 3 Jahre und 9 Monate, seit Okt. 2020
Microsystems Technology
Ostbayerische Technische Hochschule (OTH) Regensburg
Sprachen
Arabisch
Muttersprache
Deutsch
Gut
Englisch
Fließend