Ali Nadwah

Support pre-sales and after-sales activities for high-precision alignment applications in the semiconductor industry. Contribute to marketing strategy development for emerging technologies in advanced semiconductor packaging.

Technology: Pixilated matrix LED for the Automotive industry, 8-inch LED on IC wafer. *material-to-customer delivery management, and yield analysis, 8D and FMEA quality and risk assesment. *Product handover from development to production and process optimization. *Wafer processes deviation monitoring in the production line/ clean room. *Process owner for the visual inspection level of the final product.

Master thesis: Correlations and influence parameters of lens quality and active alignment precision for beam quality in RGB laser module with collimation & combination optics Optical image analysis, laser beam quality improvement, optical elements surface, and metrology measurements and analysis.

- R&D in the Packaging design of Laser Products - Laser testing and Characterization - Electro-optical Data Analysis - Active optical alignment for beam-shaping

Investigation of methods for determining the relative permeability of magnetic materials - COMSOL Multiphysics simulation.

UV-LEDs Assembly and Packaging. Chip Optical inspection UV LEDs and Laser diodes assembly and packaging using cleanroom tools: Direct bonding, Wire bonding. Interconnect material soldering Schear test - Pull test ESD Diodes characterization General study on Failure modes Analysis