Dr. Andreas Fuchs

Product Development Manager ASML BL Application Leads cross sectoral team at ASMLs Semiconductor Metrology Tool Plattform YieldStar (YS) of development and operational sectors representing around 350 employees with development and production sites across 3 continents; ensure customer satisfaction of world wide install base of >300 tools; Secures in-time delivery according specifications and budget of roadmap tool generations according to ASML product development process

Development Project Manager YieldStar Metrology Represents development and engineering in cross sector YieldStar product team; enables priority setting through scenario generation and impact analysis ; Leads team of up to 8 project leads operational as well as disciplinary covering hardware, software and application aspects of YieldStar; Secures development plan execution according scope, timing and budget with up to 150 employees

Project Lead Development and Engineering Applications/Metrology Leads multiple development and engineering projects with up to 20 resources across multi disciplines of HW (YieldStar sensor development), SW (YieldStar Measurement Software as well as Simulation tool kit for target designs) and Applications (YieldStar Measurement algorithm)

Design Engineer in YieldStar Overlay Metrology

Led German and European Union joint research projects; Led development of Step&Repeat UV-Nanoimprint Lithography tool EVG NIL 770 in collaboration with EV Group, Austria; Designed and proto type of an optical and interferometric alignment system for UV-based Nanoimprint Lithography; Developed UV-based Nanoimprint Lithography process chain (Mould fabrication, imprint process, pattern transfer, functional application); Held presentations at various national and international conferences

Semiconductors Nanoimprint Lithography