Boris Binder
Angestellt, Senior Staff Engineer Epitaxy, Infineon Technologies
Dresden, Deutschland
Werdegang
Berufserfahrung von Boris Binder
Development Engineer Epitaxy Work Area: Process development, Process Transfer
5 Jahre und 1 Monat, Jan. 2008 - Jan. 2013
Senior Process Engineer LPCVD / Epitaxy
Infineon TechnologiesSenoir Process Engineer for LPCVD Poly batch furnaces and Centura LP Epitaxy Chamber, Backup for RTCVD Centura Chamber and LPCVD Nitride batch furnaces. Work Area: Process Development, Production, Sustaining
Process Engineer for LPCVD Poly batch furnaces and Centura LP Epitaxy Chamber, Backup for RTCVD Centura Chamber and LPCVD Nitride batch furnaces. Work Area: Production Sustaining, Process Development
4 Jahre und 3 Monate, Nov. 2001 - Jan. 2006
Process Engineer RTCVD / LPCVD Nitride
Infineon TechnologiesProcess Engineer on RTCVD Centura chambers and LPCVD Nitride batch furnace. Work Area: mainly production and sustaining, some process development projects
Production Engineer RTP Work Area: production and sustaining
3 Jahre und 11 Monate, Juni 1995 - Apr. 1999
Production Engineer LPCVD / RTP
SIEMENS Microelectronic Center Dresden
Production Engineer Furnace LPCVD and RTP Work Area: production and sustaining
11 Monate, Aug. 1994 - Juni 1995
Trainee
SIEMENS Microelectronic Center Dresden
Trainee for Semiconductor Production The training was done in Corbeil Essones (SIEMENS / IBM Semiconductor Joint Venture), Regensburg (SIEMENS Microelectronics) and at Thermco Systems San Jose (Tool Supplier)
Ausbildung von Boris Binder
5 Jahre, Okt. 1988 - Sep. 1993
Elektrotechnik
TU Dresden
Informationtechnik
Sprachen
Deutsch
Muttersprache
Englisch
Fließend