Mario Schima

Responsible for 'Test Technologie' within the department 'Industrialization'

 develop and deploy inline x-ray/optical inspection machines  service intl. customer base (US, CN, EU)

Develop temporary wafer bonding and debonding technologies, Wafer test / electrical characterization, Automated optical inspection, ^^on 300mm wafer and mostly in 3D

Develop sensor packages and required manufacturing technology for high volume production in Malaysia, Transfer technology and supervise ramp up in Malaysia, Supervise electrical/optical final test in Dresden,

Development of 100W high power LED module, Development of RFID based smart label solution for environmental data logging, build individual component tracing systems,

Trainee program, Supervise thermopile assembly, Initiate and coordinate projects between production side in Malaysia and research / planning in Germany

Precision and Micro Engineering