Dipl.-Ing. Rainer Kolb

Angestellt, Head of EE Development – Systems Design and IoT 4.0 Integration, https://www.bertin-technologies.com/
Karben, Deutschland

Fähigkeiten und Kenntnisse

Research and Development
Automotive engineering
Power electronics
Electromobility
Hardware Design
Product Development
Altium
Embedded Systems
Software Development
Electrical Engineering
Wireless Sensor Networks
Git
Java
MatLab
SolidWorks
Requirements Engineering
ProEngineer
Measurement technology
Regulation technology
Thermodynamics
Engineering
Technology
Application
Hardware
Validation
Layout
Production engineering
IC Design
Cost reduction
Electric Motors
Sensor technology
Agile Development
Electrical circuit technology
Series development
Drive Engineering
Test Automation
Project Management
Release Management
WLAN Solutions
LTE
HAL System Drivers
CAN
Ethernet
Diagnostic systems
Cloud Computing
FTP over SSL
Xpedition
Mentor
CANalyzer
Vector CANoe
Display
Embedded / Real-Time / RTOS
C/C++
Communication skills
Reliability
JIRA
CAD
Technical Knowledge
PSpice
WiFi security
Threads
Eclipse
PTC
Socket Programming
Frontend
Windchill

Werdegang

Berufserfahrung von Rainer Kolb

  • Bis heute 2 Jahre, seit Mai 2024

    Head of EE Development – Systems Design and IoT 4.0 Integration

    https://www.bertin-technologies.com/

    Principal Embedded Systems Architect at Bertin Technologies. Responsible for system architecture, secure software design, and platform consolidation in nuclear, defense, and critical infrastructure applications. Focus on encryption, TLS, authentication, EMC-compliant design, and compliance-driven development. Technical lead for transforming legacy systems into secure, production-ready platforms aligned with regulatory and market requirements.

  • 4 Monate, Juni 2023 - Sep. 2023

    Senior Developer Hard- und Software, Projektierung und Ausführung

    AmbiBox GmbH

    Senior Developer Hard- and Software BiDir E-mobility Charging, High Voltage/High Power DC-DC/AC/DC, HMI, Ethernet TCP-IP/ MQTT, Wifi-WLan Bridging, SiC-Mos Driver, Secutity, Can /I2C/ SPI/ Adc/I2S, Intercontroller- Comm., NFC-(ISO/IEC 14443 und ISO/IEC 18092) ISO 21448,21212 Vehicle-to-Grid (V2G), V2V BPT ISO 15118‑20 HMI Schaltplan und Layout (Altium/Expedition) Software Hal Driver for Wifi/RfId, Ethernet, CAN, Serial I2C and Communication Implementation for Espressif, TI and Microchip Embedded Devices

  • 32 Jahre und 8 Monate, Okt. 1990 - Mai 2023

    Senior Embedded Systems Architect / Technical Authority

    KION GROUP AG

    Responsible for end-to-end architecture of complex embedded electronic systems across multiple product generations in industrial vehicles including architecture decisions, design approvals, EMC, validation, and production release, with full technical authority and functional leadership. Communication architectures (CAN, telematics, IoT). Global cross-site responsibility including coordination, know-how transfer, and alignment of development, testing, and industrialization.

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