Richard Platt

Identify underperforming areas, architecting customized innovation management processes and infrastructure while deploying tools in support of organizational needs. Responsible for the architecture and implementation of innovation methods program known as The Intel Theo

Responsible for Quality Plan for products in the ATCA design environment. Driving continuous improvement of design team’s problem solving capability and push the use of the following: automated DFM tools, using SPC tools and lowering the risk of product defects released to production factories.

Responsible for driving the development of new technologies for a number of different technology and business unit groups across the Intel enterprise

Responsible for the manufacturing development and readiness from New Product Introduction phase all the way through to sustaining in the High Volume Manufacturing environment.

Evaluated the process capability for potential changes to a modified manufacturing capability to better accommodate high mix - low volume manufacturing volumes

Find root causes to problems found in the manufacturing of 777 airplanes components and then drive solutions across work areas as needed.

Responsible for managing all of the manufacturing program deliverables for motherboard products developed in the New Product Development phase preparing products for transfer to High Volume Manufacturing

In process