Rob Van Lier
Angestellt, Director Engineering, Qualcomm MEMS Technologies, Inc.
San Diego, Vereinigte Staaten
Werdegang
Berufserfahrung von Rob Van Lier
Bis heute 11 Jahre und 10 Monate, seit Dez. 2012
Director Engineering
Qualcomm MEMS Technologies, Inc.
• Member of the Patent review board • Manage the System Integration team to prototype new features and create platforms. Other team responsibilities are feasibility studies and prepare features for final integration on chip level. • Leading position in the systems architecture team. • Define new driver architectures for Mirasol displays. Create overlap between driving methods and voltage generation. Specialized in the power management for display modules. Define partitioning between IC and panel
2 Jahre und 9 Monate, Apr. 2010 - Dez. 2012
Engineer, Principal/Mgr
Qualcomm MEMS Technologies
• Manage the System Integration team to prototype new features and create platforms. Other team responsibilities are feasibility studies and prepare features for final integration on chip level. • Leading position in the systems architecture team. • Define new driver architectures for Mirasol displays. Create overlap between driving methods and voltage generation. Specialized in the power management for display modules. Define partitioning between IC and panel
3 Jahre und 7 Monate, Okt. 2006 - Apr. 2010
Engineer, Senior Staff
Qualcomm MEMS Technologies
Leading position in the systems architecture team. Define new driver architectures for iMod displays. Create overlap between driving methods and voltage generation. Specialized in the power management for display modules. Define partitioning between IC and panel for future module architectures.
2 Jahre und 5 Monate, Mai 2004 - Sep. 2006
Systems Architect
Philips Mobile Display Systems
Define IC roadmaps. Define electronic architectures of new products. After predevelopment transfer the design to project teams to finalise and bring to mass production. Interface between product creation and advanced technology. Responsible for integration of new features in display drivers, like new power architectures, high-speed serial interfaces, and algorithms to improve front of screen performance. Implementation of multi output inductive booster architectures in LTPS display drivers.
4 Jahre und 3 Monate, März 2000 - Mai 2004
Senior Electronic Engineer
Philips Mobile Display Systems
Know How Creation to develop EMC compatible products for the Automotive market. Development of illumination electronics to drive CCFL backlights for Automotive displays. Know How Creation power reduction Colour-STN displays. Know How Creation for new power architectures in mobile display systems including DC/DC conversion regarding to CSTN and TFT displays, LED backlights in combination with electronics for ambient light control and temperature compensated LED-current.
1 Jahr und 2 Monate, Jan. 1999 - Feb. 2000
RF Engineer
Philips Components
Development of passive integrated circuits for mobile phones as power-amplifiers and blue-tooth modules
1 Jahr, Jan. 1998 - Dez. 1998
Senior Equipment Engineer
Philips Components (Thin Film Components)
Development of production equipment for laser trimming of conventional/chip-resistors and laser scribing and breaking of ceramic substrates. Development of equipment for resistor measurements related to: value, linearity, temperature coefficient, pulse load tests, real-time measurements during laser trimming process.
3 Jahre und 2 Monate, Nov. 1994 - Dez. 1997
Equipment Engineer
Philips Components (Fixed Resistors)
Development of production equipment for laser trimming of conventional/chip-resistors and laser scribing and breaking of ceramic substrates. Development of equipment for resistor measurements related to: value, linearity, temperature coefficient, pulse load tests, real-time measurements during laser trimming process.
Ausbildung von Rob Van Lier
3 Jahre und 11 Monate, Aug. 1988 - Juni 1992
Electronic Engineering
Fontys Hogescholen
Computer Science
Sprachen
Niederländisch
Muttersprache
Englisch
Fließend
Deutsch
Gut