Sagnik Mondal

• Achieved hollow defect-free electroplated copper deposition in 400 µm TSVs. • Evaluated the effectiveness of plating additives as a function of mixture ratios. • Characterized deposition tolerance against position of TSV on wafer. • Collaborated cross-functionally to ensure smooth experimental workflows. • Contributed to technical discussions and documentation for core and side projects.

• Designed and supported experiments across multiple PhD research projects. • Evaluated surface treatment and etching techniques to fabricate metal nanostructures. • Achieved >80% monolayer coverage in nanosphere lithography via spin coating. • Analysed and documented experimental results using SEM, AFM, and related techniques. • Developed COMSOL models, MATLAB scripts, and microcontroller-based programs.