Simon Gubser

- R&D of Wafer Level Optics and semiconductor packaging. - Implementation of "Design of Experiment (DOE) in company.

Joined ams through its acquisition of Heptagon. Set-up and lead intercultural automation team of 10+ engineers with respective focus in mechanics, electronics/software & vision. Automation of entire manufacturing plant in Singapore. Aligned with ams plans to spend several 100million USD over time for manufacturing plants in Singapore. Successfully implemented processes and equipment to achieve significant, •Cost reduction & •Quality improvement

Management of development projects focused on consumer electronics sensors, from design till mass production. •Managed relationships with engineering counterparts at customers – leading providers of mobile devices •Developed and managed relationships with suppliers; evaluated equipment.

Process and technology development for lens replication processes and micro optics packaging, 6 patents in 3 years. Technology transfers to Singapore.

Process development for electronic thin film circuits. Development and optimization of PVD, plasma and lithography processes, including equipment evaluation. Technical project management of customer projects. •Developed and implemented new manufacturing process to move from 6” to 24” wafers, biggest in the industry. •Developed a method to improve adhesion of metals on polymers, resulting in significantly improved yields.

Apprenticeship at Unaxis (Today, OC Oerlikon). Studies in several fields such as thin film technology/coatings, vacuum technology, electronics and optics.

Mikrotechnische Systeme, Technologie dünner Schichten, Optik