Andaç Hidayet Talay

Angestellt, Technical Product Lead, AERQ
Hamburg, Germany

Fähigkeiten und Kenntnisse

Electronics
Altium Designer
C/C++
Testing
System Integration
Product Design
Product Development
Embedded Systems
Microcontroller
Requirements Analysis
EAGLE
PLM
Scrum
Hardware Design
Project Planning
Verification and validation
Production planning and control
ISO 13485
IEC 60601
Product
Hardware
Stakeholder Management
Supplier Management
PTC Windchill
Atlassian Jira
Atlassian Confluence
German
English Language
Windows
Technical project management
Requirements Engineering

Werdegang

Berufserfahrung von Andaç Hidayet Talay

  • Current 3 years and 6 months, since Dec 2022

    Technical Product Lead

    AERQ
  • 1 year and 9 months, Mar 2021 - Nov 2022

    Electronic Design Engineer

    AERQ
  • 1 year and 6 months, Sep 2019 - Feb 2021

    Senior Professional

    FERCHAU GmbH
  • 1 year and 4 months, Sep 2019 - Dec 2020

    Senior Test Engineer (on behalf of Ferchau)

    Philips Medical Systems DMC GmbH

    Creation of Verification Plan and Verification Specification documents. Coordination of activities with the teams in India and China. Preparation of test places and performing pre-verification tests. Analyzing requirements and writing corresponding test cases. Developing practices with Agile methodology within SAFe.

  • 1 year and 6 months, Nov 2017 - Apr 2019

    Electronic Development Engineer

    develogic GmbH

    Project planning, resource management and team coordination for in-house production tasks. Product portfolio management of ~120 PCB’s and ~800 electronic components (including OEM parts and several sensors). Testing, troubleshooting and repairing of subsystems. Technical documentation for manufacturing, integration and testing. Project coordination with customers, suppliers and interdisciplinary teams. Budget control, managing component purchase orders and supplier evaluation.

  • 2 years, Nov 2015 - Oct 2017

    Electronics Engineer

    HotSwap Lübeck GmbH

    Product development and consulting on medical device development projects (design for manufacturing). Design and development and design review of high density PCB’s up to 8-layers (Altium Designer, Eagle). Application of electrical safety principles in accordance with IEC 60601. Application of risk management and quality management principles in accordance with ISO 13485. On-site customer support under "Arbeitnehmerüberlassung" contract.

  • 7 months, Jan 2016 - Jul 2016

    R&D Engineer (on behalf of HotSwap)

    Thermo Fisher Scientific

    Assembly and testing of high gain amplifier PCB’s in Mass Spectrometry department. Development of test hardware for verification of reed relays (Mentor Graphics DxDesigner Schematic). Instructing and training the supplier for mass production and assembly tasks. Creating and documenting hardware specifications, test reports and technical instructions.

  • 2 years and 5 months, Nov 2012 - Mar 2015

    Electronics Engineer

    INSYEN AG

    Designing, developing, prototyping, testing and maintaining hardware systems for L-3 WESCAM MX™ - Simulator and MX™ - Emulator products (www.insyen.de/products).

  • 6 months, May 2012 - Oct 2012

    Master's Thesis

    INSYEN AG

    The aim of this thesis is to make a quantitative analysis for the simulated infrared sensor scenes. Thus, this thesis contributes towards understanding the simulated scene generation from VBS2 simulation engine, infrared image segmentation techniques, infrared image processing techniques and quantitative analysis techniques and their applications in MATLAB.

Ausbildung von Andaç Hidayet Talay

  • 2 years and 6 months, Oct 2010 - Mar 2013

    Space Technology

    Technische Universität München

    Remote Sensing

  • 4 years and 10 months, Sep 2004 - Jun 2009

    Electrical and Electronics Engineering

    Eskisehir Technical University

    Digital Systems

Sprachen

  • German

    C1 (Fließend)

  • English

    C1 (Fließend)

  • Turkish

    C2 (Verhandlungssicher / Muttersprachlich)

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