Christian Herberg

Setting the company up. Focus on innovative system development and chip design. System platform for M2M and automotive eCall markets.

Offering project management services to customers developing electronic system hardware and software.

Preparation of a new venture. Chip development for industry automation sensor applications. Business plan found unfeasible.

Head of the digtial-TV chip design group at Micronas. 4-11 direct reports.

Chip development for digital-TV STB and flat-panel TV markets: Project leader directing international teams of 24-80 engineers, integrating video, audio, graphics, embedded controllers, integrating MPEG decoders and A/V processing pipelines, using 0.18µm, 90nm and 65nm CMOS technologies. Advancement of project planning and controlling methods. Directing and coaching teams of subproject leaders. Responsible for the R&D wide project steering board (Jan 2006 - Apr 2009).

Chip development for iDTV market: Project leader directing an international team of 36 engineers, integrating video, audio, graphics and embedded controllers, integrating decoders and A/V processing pipelines, using a 0.18µm CMOS embedded DRAM technology, development cooperation with an Israeli company.

Corporate CAD chip design flow development: Project leader for the sections "circuit modelling" and "design flow regression". Chip development for analog and digital TV market: Project leader directing a team of 11 engineers, integrating teletext, graphics and embedded controller using a 0.25µm CMOS technology.

Design of ASICs for digital signal processing in fiber optical and radio telecommunication links using a 0.35µm CMOS technology.

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