Karl Huber

Product Launch Logistics: New Product Introduction (Line development, equipment and contractor selection)

Partners: 1) Cubit Pte Ltd (2nd Source Semiconductor Equipment / Parts) 2) SIP GmbH - Yield Consulting Yield Improvement & Process Stabilization * Product Flow Integration {CMOS, Bi-CMOS, LDMOS} * Process / Equipment Integration {BEOL, MOL, FEOL} * Yield Metric {Identification, Monitoring} * Foundry Consolidation {Bench Marking, Knowledge Sharing} * Defectivity / Variance Source {Identification, Elimination} * Production {Transfer, Ramp, Continuous Improvement (6 Sigma)}

Test Engineer (Installation/Applications) / Office Manager (Jan. 2012 to March 2013) Resolution of Process and Test Instabilities, Hardware / Tool Installations, Software Upgrades, and Tester Maintenance. Staff Consultant (28, 40, and 45nm Technology Nodes) (Nov. 2010 to Dec. 2011) Identified In-line excursion signatures, worked with client to implement corrective actions. Set-up automated reports & Presented “Health of Line” updates to client for review.

Lead Equipment Engineer for the Factory Start-up. Collaborated with several cross functional groups (Process, Operations, Facilities, IT) to ensure the facility was prepared for equipment arrival. • Generated Equipment and Facility Requirements for Acceptance, Development & Volume Production • Vendor Evaluations (Equipment, Metrology (external, and in-line), Rigging, Material Sourcing…)

• Established Monthly Management/Customer comparison report listing multiple parameters over 5 Foundries located in Germany, USA, Taiwan, and China. • Established Comparison Ranking between Sites (Leading/Trailing) with correlating margin. • Defined detailed rules of reaction based on Parameter Significance, Margin of Difference, and Target to Baseline Performance. • Initiated and drove alignment activities to reduce “known” variation sources.

Managed Thin Film Operation & Development Groups. •Metal Resistivity Drift – Problem existed since development of key technology (9 months). Quick identification of source and solution enabled shipment of material to meet Final Quarter and End of Year Goals. •Lead Technologist - 3 Technologies ramped •Capacity Improvement – DSTI CMP, RTA, ILD, IMD, Metallization, and Passivation Process Convergence.

Managed PVD/MOCVD thin film processes. Directed critical multi-million dollar tool installations (200mm) required to meet forecasted line capacity needs; Led projects for evaluation / pre-acceptance and approval for key Process and Metrology tools associated with initial pilot line ramp for Chartered’s first 300mm fab startup.