Sabbir Shirajus Salekin

-Laser Diode packaging technology development -Improving the reliability of laser package -Optimization of wire bonding and die bonding to minimize thermal stress

-Developed Electro Magnetic shielding technology -Developed BGA packaging technologies

-Successfully achieved smallest solder depots of average diameters of 82±7 μm (n= 1024) by using a type 7 solder paste and employing the jetting application method and electrically tested on PCB. -Performed Rheological characterization of solder paste using plate-plate rheometer. -Performed time pressure dispensing, jetting and jet stamping. -Tested adhesive bond strength between dies and substrate by using Dage Shear test equipment.

-Successfully fabricated semiconductor pressure sensors by photolithography, etching, sputtering, and physical and chemical vapor deposition in a cleanroom laboratory -Successfully stabilized the temperature of organic platform by programming Arduino micro-controllers for a LTCC fluidic test. -Designed Printed Circuit Board using Eagle Software and successfully implemented the design

Fabricated pressure sensor in the clean room using photo-lithography, etching and PVD & CVD Constructed of a test chamber for evaluating the sensitivity of gas sensor Manufactured LTCC & Hybrid IC using thick film technology Wrote a review paper on the basics of Stretchable electronics

-Electronics -Microelectronics -Programming Language C -Verilog HDL -Semiconductor -Transistor: MOSFET