Nicola Leotta

Angestellt, Project Manager, Scrum Master & Business Analyst - Biometrics and AFIS, SAFRAN Identity and Security (formerly known as 'Morpho')

Osny, Frankreich

Fähigkeiten und Kenntnisse

Project Leader
multi-cultural
Subcontractors management
Activities promotion
requirements analysis
Purchase-Marketing
multi-supplier development
sourcing and OED/OEM
Mobile Telecom
Electronics
System Architecture
System Design
Technology survey
ScrumMaster
Agile Methods

Werdegang

Berufserfahrung von Nicola Leotta

  • Bis heute 15 Jahre und 5 Monate, seit Jan. 2009

    Project Manager, Scrum Master & Business Analyst - Biometrics and AFIS

    SAFRAN Identity and Security (formerly known as 'Morpho')

    • Restored balance to a cross-site Agile Project Scrum team (lower pressure and better quality). • Streamlined a Product Maintenance policy by -30% budget cut, while maintaining customer’s satisfaction. • Functional negotiation for biometrics identification systems (Needs analysis and challenging assumptions). • Initiated the development of a generic biometrics search engine, now a key Asset of Morpho.

  • 1 Jahr und 1 Monat, Jan. 2008 - Jan. 2009

    Core Platform Project Manager

    Sony Ericsson Mobile Communications

    >30% price-down achieved on ultra low cost phone, through engineering and sourcing common actions.

  • 7 Jahre und 6 Monate, Juli 2000 - Dez. 2007

    UMTS Handset Platform Project Leader

    NEC Technologies (UK) Ltd

    in charge of 5 subsequent Platforms of EDGE-HSDPA dual mode mobilephone : system design, development, system-integration and tests.

  • 2 Jahre und 5 Monate, März 1998 - Juli 2000

    Sr System Engineer

    Alcatel Mobile Phone

    GSM Handset Power management system design UMTS Baseband System design

  • 3 Jahre und 6 Monate, Sep. 1994 - Feb. 1998

    R&D Department Manager

    Thales International Japan K. K.

    Provide Thales group with access to advanced dual Technologies in Japan : - Dual Technologies = both for consumer and professional and military applications. - Technology and industrial survey, develop demonstrators and source components and sub-systems in Japan, especially in key materials, displays (PDP, LCD, CRT) and micropackaging technologies for Radar and Radiocomm applications (BGA/CSP, bare-chip, 'build-up' PWB, high-frequency interconnect, Millimetric wave low cost packaging technologies...)

  • 9 Monate, Jan. 1994 - Sep. 1994

    Electronics Engineer

    Thales Group

    - Tech Surveys & Reverse Engineering on Microelectronics packaging (PCB + LSI casings+ bare chip) - Electrical Simulations of Flat panel’s connectors and conductors (LCD or K7X).

Ausbildung von Nicola Leotta

  • 1990 - 1993

    AIE (microelectronique)

    Ecole Superieure d'electricite

Sprachen

  • Französisch

    Muttersprache

  • Englisch

    Muttersprache

  • Italienisch

    Fließend

  • Japanisch

    Fließend

  • Deutsch

    Gut

Interessen

Mobile Telecom
Electronics
business development
biometry
Japan
Identity Management
Agile Methods

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